Microelectronics Packaging Technical Manager, Senior

Nice To Have:

• Experience working with microelectronic advanced packaging
• Experience with guiding a team through the development, testing, and implementation stages, including review completed work, provide feedback, and delegate tasks
• Experience as a mentor providing technical training to team members
• Ability to interpret defense needs related to advanced packaging, evaluate the performance of packaging technologies and vendors, and develop a technology and business roadmap that defines the path forward to senior stakeholders
• Ability to communicate effectively with team members and clients and to develop professional presentations and brief senior leaders on topics both technical and programmatic
• Ability to perform analytical calculations, provide accurate technical assessment of various approaches, and incorporate these into technology roadmaps to guide industry activities
• Ability to make quick decisions and solve technical problems to provide an efficient environment for project implementation
• Secret clearance
• Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering or Semiconductor Physics

Nice If You Have: 

• Experience with ASIC and SOC flows pertaining to chiplets
• Experience with electronic warfare, radar, radiation environments, RF, optoelectronics, enabling technologies, such as “at the sensor” compute, and artificial intelligence processing
• Knowledge of project requirements
• Ability to provide support to non-technical team members
• Ability to stay firm to schedules and hold self and others accountable
• Ability to develop action and mitigation plans